| IT Essentials 8 & ITE 7.02 | |
| IT Essentials 8 & ITE 7.02 - Final - Mid-term - Cert | |
| Chapter 1 -9 Skills Assessment | NA |
| Chapter 10 - 14 Skills Assessment | NA |
| Practice Final Exam Answers Ch 1 - 9 | Online Test |
| Practice Final Exam Answers Ch 10 - 14 | Online Test |
| Final Exam Answers Ch 1 - 9 | Online Test |
| Final Exam Answers Ch 10 - 14 | Online Test |
| Final Exam Composite Answers Ch 1 - 14 | Online Test |
| A+ 220-1001 | Online Test |
| A+ 220-1002 | Online Test |
When a new motherboard is being installed, between which two components must thermal compound be applied? (Choose two.)
- CPU
- RAM
- chassis
- heat sink
- chipset
- motherboard
Explanation: You must apply thermal compound between the new CPU and the heat sink/fan assembly to avoid overheating the CPU. The thermal paste helps to conduct heat from the CPU to the heat sink.
| IT Essentials 8 & ITE 7.02 | |
| IT Essentials 8 & ITE 7.02 - Final - Mid-term - Cert | |
| Chapter 1 -9 Skills Assessment | NA |
| Chapter 10 - 14 Skills Assessment | NA |
| Practice Final Exam Answers Ch 1 - 9 | Online Test |
| Practice Final Exam Answers Ch 10 - 14 | Online Test |
| Final Exam Answers Ch 1 - 9 | Online Test |
| Final Exam Answers Ch 10 - 14 | Online Test |
| Final Exam Composite Answers Ch 1 - 14 | Online Test |
| A+ 220-1001 | Online Test |
| A+ 220-1002 | Online Test |